Asymmetric heat spreader for stylish heat dissipation
Compatible with Intel and AMD platforms
Easy to install - Plug-and-Play functionality
Automatic Overclocking - reach faster speeds and higher capacities by just installing the memory, no adjustments in BIOS needed
Unique - tested with all popular brands of motherboards
Guaranteed - lifetime warranty, free technical support
Reliable - 100-percent factory tested
DESCRIPTION
HyperX HX318C10FK2/8 is a kit of two 512M x 64-bit (4GB) DDR3-1866 CL10 SDRAM (Synchronous DRAM) 1Rx8 memory modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-1866 at a low latency timing of 10-11-10 at 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard
electrical and mechanical specifications are as follows:
Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS.
FEATURES
JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
933MHz fCK for 1866Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address 000 only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.180 (30.00mm), single sided component
