DESCRIPTION HyperX HX318C10FRK2/8 is a kit of two 512M x 64-bit (4GB) DDR3-1866 CL10 SDRAM (Synchronous DRAM) 1Rx8 memory modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-1866 at a low latency timing of 10-11-10 at 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
PCB : Height 1.180” (30.00mm), single sided component
CL(IDD) 10 cycles Row Cycle Time (tRCmin) 44.75ns (min.) Refresh to Active/Refresh 260ns (min.) Command Time (tRFCmin) Row Active Time (tRASmin) 32.125ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V - 0 Operating Temperature 0oC to 85oC Storage Temperature -55oC to +100oC *Power will vary depending on the SDRAM used.
* Specifications are subject to change without notice. * Specifications may vary. * The product picture(s) is only for your reference, it may differ from the actual product.