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SPECIFICATIONS:
Thermal Conductivity
> 5.15W/m-K
Thermal Impedance
3.25 g/cm3
Viscosity
12500
Thixotropic Index
280±10 1/10
Moment Bore Temperature
-50 +340 °C
Operation Temperature
-30 +280 °C
Silicone Compounds
10%
Carbon Compounds
45%
Metal Oxide Compounds